Thursday, 2 June 2016

Information present in technology files,design spec and information from top level engineer(physical design flow).


  • Cell delays and there output slews based on different PVT conditions.
  • Height of Standard cells.
  •  Resistance, Capacitance of metal layers.
  •  Die size.
  •  Core Area.
  •  Ports info,
  •  Scan chain Information.
  • Technology used.
  •  widths and spacing of metal layers. 
  • Area of the standard cells and Macros.
  • Static leakage currents of the standard cells
  • Threshold voltage of the standard cells.
  •  Macros netlsit's.(from vendors)
  • Macros blockages information.
  • SDC file